Reaction-bonded Silicon Carbide IntrinSiC® (3D-printed)

Ultra light and extremely hard

Reaction-bonded silicon carbide IntrinSiC® (3D-printed):

With IntrinSiC®, we are redefining the dimensions in 3D printing: For the first time, ceramic components made of nearly diamond-hard silicon carbide (RBSiC) are possible via 3D printing, which were previously not feasible due to their size, complexity and quality requirements.

What makes IntrinSiC® stand out?

All the very good properties you are used to from Schunk's RBSiC are transferred to the new dimension of 3D printing by IntrinSiC. IntrinSiC® is characterized by enormous stiffness and strength, low thermal expansion, high Weibull values and temperature resistance, low thermal mass and high hardness.

Where is IntrinSiC® used?

IntrinSiC® is used wherever complexity and size are relevant: Machine frames, diffusion furnaces, complex high-performance burners, body protection panels, aviation protection panels as well as helicopter seats. Thanks to the freedoms of 3D printing, previously unfeasible geometries and undercuts are possible. Weight-optimized components can be produced in sizes up to 1.8 m x 1.0 m x 0.7 m as a monolithic component. The combination of low thermal expansion with high thermal conductivity, very high stiffness and high Weibull modulus also make IntrinSiC® the perfect solution for space applications and measuring machine components where the highest precision is required.

Material microstructure of the technical properties and surface structure of IntrinSiC

Special properties of IntrinSiC®:

  • Density: 3.05 g/cm³
  • Weibullmodul: 14
  • Coefficient of thermal expansion [10^-6/K] 3.9
  • Thermal conductivity(room temp.): 200W/mK
  • Flexural strength: 210 MPa
  • Modulus of elasticity: 380 GPa



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