AIXEMTEC offers industry solutions for the mass production of photonic components: packaging, inspection, and testing with the highest precision and speed. Check out our end-to-end platform solution for cable harnesses for Co-packaged Optics (CPO) covering AOI, active alignment, precision bonding, and CPO-optimized thermal curing as an integrated solution with high autonomy. As part of the Schunk Group we are able to scale machine production to the demand of the most demanding markets. AIXEMTEC develops modular micro-assembly and test platforms for the automated production of photonic components and systems. From fiber-to-chip coupling and PIC packaging to VCSEL/laser modules and camera optics. Our latest end-to-end platform for co-packaged optics (CPO) cable harnesses integrates AOI, closed-loop active alignment with sub-micron accuracy, precision bonding, and CPO-optimized thermal curing with high autonomy. Our platform architectures scale from feasibility and prototyping to 24/7 high-volume turnkey manufacturing. The Schunk Group is used to scaling machine production to hundreds of units per year in order to meet the demands of dynamic markets.