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Ultrasonic welding technology by Schunk Sonosystems for power contacts in IGBT power modules

IGBT power module with ultrasonically welded power terminals

Copper terminals on DBC substrate. The terminals are located in a fixed frame module and are welded to the DBC substrates which are connected to a cooling plate.

Features:

  • Thickness: 0,8 mm, welding area: 2,5 x 2,5 mm or
  • Thickness: 1 mm, welding area: 3,5 x 3,5 mm
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Power Electronics - SIRUS
Power Electronics - SIRUS

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