Mechanical Engineering. Meeting the Highest Requirements.

High-performance machines require high-performance materials. Whether in aerospace, metrology or semiconductor technology, the quest is for minimized weights, increased load-bearing capacity and enhanced precision. When measuring machines reach the limits of the measurement accuracies to be realized, space applications require minimum weight at maximum load, or semiconductor systems enter the realm of atomic size during processing, ceramics are increasingly the only possible alternative to realize structural elements of the systems or individual process components. 

Our patented IntrinSiC® manufacturing process combines the outstanding material properties of silicon infiltrated reaction bonded silicon carbide (RBSiC) with the process engineering advantages of 3D printing. Where shapes were once defined by manufacturing processes, today it's all down to your imagination. IntrinSiC® offers you design potential in new dimensions - even large and complex structures with undercuts and cavities can be produced in a single manufacturing step. The machine hours required for geometry milling in other processes are thus completely eliminated. With IntrinSiC® you can significantly reduce your carbon footprint, making it easier to achieve your sustainability goals. Compared with conventional approaches, you save around 25% Co2 - and if you take into account the reusability of excess powder, the figure is as high as 70%.